Samsung Wins 5-Nanometer Modem Chip Contract From Qualcomm (reuters.com) 18
Samsung Electronics semiconductor manufacturing division has won a contract to make new Qualcomm 5G chips using its most advanced chip-making technology, Reuters reported Tuesday, citing sources familiar with the matter said, boosting the Korean firm's efforts to gain market share against rival Taiwan Semiconductor Manufacturing. From the report: Samsung will fabricate at least some of Qualcomm's X60 modem chips, which will connect devices such as smart phones to 5G wireless data networks. The X60 will be made on Samsung's 5-nanometer process, the sources said, which makes the chips smaller and more power-efficient than previous generations. One of the sources said TSMC is also expected to fabricate 5-nanometer modems for Qualcomm. Samsung and Qualcomm declined to comment, and TSMC did not immediately respond to a request for comment. Best known among consumers for its phones and other electronic devices, Samsung is the world's second-biggest chip manufacturer through its foundry division, self-supplying many of its own mobile phone parts and also fabricating chips for outside customers such as IBM and Nvidia, among others.
Are we running out of Nanometers? (Score:2)
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The negative-nanometer tech should be really fast.
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It's true that we are running out of nanometres, but scientists have been planning for a while now to replace them with ethically-sourced femtometres.
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5-nanometer process
My understanding that smaller fabs will consume less power. So the same chip using 5-nanometer fab will consume fraction of power of 22 nm chip everything else equal. For a cell modem, that is major source of power drain, this energy efficiency is a big deal.
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Failure Rates (Score:2)
Can anyone from the silicon industry comment on how these smaller feature sizes translate to run-time random failure rates like bit flips? Smaller features take less energy to upset don't they?
As a counterexample I'm used to "radiation hardened" parts are often the same design just fabbed with larger features and packaging with shielding so they take more energy to switch.
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Can anyone from the silicon industry comment on how these smaller feature sizes translate to run-time random failure rates like bit flips? Smaller features take less energy to upset don't they?
For radiation induced soft errors, it is about capture volume and charge. Smaller feature sizes require less charge to change state but less area means less volume to capture charge. So with DRAMs where charge was relatively constant as feature size decreased because of process improvements, radiation resistance stopped getting worse or even got better in the last few generations.
So minimum feature size by itself does not relate very well to radiation induced soft error rate.
As a counterexample I'm used to "radiation hardened" parts are often the same design just fabbed with larger features and packaging with shielding so they take more energy to switch.
Radiation resistant features m
Who? I thought only Huawei had 5g (Score:1)
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Huawei's 5G specialty is on the tower side. I'm not sure they manufacture any/many modems.
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https://www.reuters.com/article/us-qualcomm-tech/samsung-huawei-supply-majority-of-own-modem-chips-qualcomm-says-idUSKCN1OZ00F
Is it really 5nm? (Score:2)
Samsung's 5nm process is roughly equivalent (but a little bit denser than) to TSMC's latest 7nm process, or Intel's 10nm process, and is much less dense than TSMC's 5nm process. So... keep this in context.