Mac Rumors reports, citing Japanese website Mac Otakara, that Apple will release an updated iPhone SE next month with a similar form factor as the previous model. It is expected to retain Touch ID, but will drop the 3.5mm headphone jack. From the report: Also like the iPhone 7 and iPhone 7 Plus, the new iPhone SE will supposedly be powered by Apple's last-generation A10 Fusion chip, up to 40 percent faster than the A9 processor in the current iPhone SE. The chip will likely enable support for the HEIF image format and HEVC video compression standard. The report speculates that the new iPhone SE may have a glass back with wireless charging capabilities, like the iPhone 8, iPhone 8 Plus, and iPhone X, but evidence is said to be inconclusive at this time.