MojoKid writes from a report via Hot Hardware: ARM has been working closely with TSMC for years now. Over the last six years or so especially, ARM and TSMC have collaborated to ensure that TSMC's cutting-edge process technologies work well with ARM's processor IP. However recently, ARM just announced the successful tape-out of a test chip featuring next-generation, 64-Bit ARM v8-A mobile processor cores, codenamed Artemis, manufactured using TSMC's upcoming 10nm FinFET process technology. The test chip features what ARM calls an Artemis cluster. It's essentially a quad-core processor with power management IP, a single-shader Mali graphics core, AMBA AXI interconnect, and test ROMs connected to a second cluster by an asynchronous bridge that features the memory subsystem, which is stacked with a Cortex M core that handles control logic, some timers, SRAM, and external IO. Compared to 16nm FinFET+, at nominal voltage, the 10nm test chip offered a 12% performance improvement in a similar power envelope. In super-overdrive mode (Vsod), the Artemis test chip offered similar performance, but at 30% lower power.SoCs for premium mobile devices with next-generation cores produced on the 10nm process node are expected to arrive later in the second half of this year.