An anonymous reader writes with a snippet from HelpNet Security about a technology that sounds promising down the road for consumer equipment, but may land a lot sooner than that in high-end applications where cooling is critical: Thousands of electrical components make up today's most sophisticated systems – and without innovative cooling techniques, those systems get hot. Lockheed Martin is working with DARPA on its ICECool-Applications research program that could ultimately lead to a lighter, faster and cheaper way to cool high-powered microchips – by cooling the chips with microscopic drops of water. This technology has applications in electronic warfare, radars, high-performance computers and data servers. The micro-cooler is only 250 microns thick, and 5 millimeters long by 2.5 millimeters wide.
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