from the i-need-the-yellow-capacitor dept.
MattSparkes writes "It seems that 3D silicon chips, allowing designers to fit more components into a smaller space, could soon be made far easier to create with a little inspiration from a classic children's toy. "Silicon wafers covered with matching patterns of Lego-like teeth and holes could aid the development of 3D electronics, say UK researchers." Crucially, this technique can make use of existing machinery."
Top Ten Things Overheard At The ANSI C Draft Committee Meetings:
(8) I'm on the committee and I *still* don't know what the hell
#pragma is for.