Extreme Ultraviolet Chip Manufacturing Process Technology Closer To Reality 49
MojoKid writes "One of the greatest obstacles standing between chip manufacturers and the pursuit of smaller, faster, processors is the lack of a proper light source. Current chips are etched using a deep ultraviolet wavelength of 193nm, but at a 28nm semiconductor process geometry, we've reached the limits of what a 193nm wavelength is small enough to etch. Extreme ultraviolet lithography (EUV) has been pegged as the most likely replacement for current 193nm technology, but repeated problems with ramping EUV have left it stalled on the runway. Now, for the first time, foundry technology developer ASML, which made headlines last year by partnering more closely with Intel and TSMC, believes it has cleared some of the hurdles between it and widespread EUV commercialization. The company predicts EUV technology could be ready for ramp by 2015. Two problems have stymied EUV deployment thus far. The first is the strength of the light source. Generating EUV at the intensities required for mass production can require as much as an order of magnitude more input power than conventional lithography. Second, there's the issue of exposure time. The two are linked — a higher-power system can etch wafers more quickly, but the power requirements could edge into the kilowatt range for each piece of equipment. The NXE:3300, which ASML is shipping this year, will be capable of hitting 125 wafers per hour, once the company boosts the light source up to 250W. That boost is still off in the future. Current NXE:3300 machines are targeting 80W by the end of the year."
seriously?! (Score:2, Informative)
someone explain to me how this is any different to the story posted not 48 hours ago http://hardware.slashdot.org/story/13/08/05/2336251/euv-chipmaking-inches-forward
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You'd think the editors would actually read slashdot - even just the titles?
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you think there are editors on Slashdot, how cute.
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This time they didn't use the acronym in hopes of garnering more posts.
Re:seriously?! (Score:5, Interesting)
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someone explain to me how this is any different to the story posted not 48 hours ago http://hardware.slashdot.org/story/13/08/05/2336251/euv-chipmaking-inches-forward [slashdot.org]
You have to read it through a mirror whilst hanging upside down and whistling the theme tune to "I love Lucy"
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Dupe (Score:1)
Is this really needed here again? Same source, different article.
Dupe! (Score:1)
Dupe (Score:1)
From the department of redundancy department.
EUV Wavelength? (Score:2)
The article makes no mention of the new wavelength, is it the same? It does mention a 10nm node, but that could be the targeted process geometry.
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13.5nm
No wonder the GP didn't see it - that's a really small font.
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Multiple patterning and immersion lithography.
Re:Fabrication sizes (Score:5, Funny)
If we've reached the limits with what ultraviolet lithography can do already at 28nm, then how can Intel and other companies produce chips fabricated on smaller scales, given that they are alreaday at 22nm with 14nm coming within the next year or so?
Aren't those chips made of silicone [wikipedia.org]? Maybe they stretch the chip before etching and let it shrink after.
(ducks)
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You may think you're joking, but there is actually a microfab technique based on shrinky-dinks. Pattern some thermoplastic and then cook it to shrink the dimensions. It's more for creating micro-scale forms on the cheap, rather than for these sort of nano-scale silicon features, but the idea isn't totally crazy.
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You may think you're joking, but there is actually a microfab technique based on shrinky-dinks.
I knew that - a branch of soft lithography.
Just confused on why this would be a reason not to consider I'm joking.
Unfortunately... (Score:2)
...Slashdot dupe detection technology is still many years off. It will take major advancements in AI before we'll be able to detect duplicates like this [slashdot.org].
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TFA from last time (Score:2)
EUV Chipmaking Inches Forward [ieee.org] (IEEE Spectrum)
Features smaller than one wavelength? (Score:1)
I'm kind of surprised that photons of 193nm wavelength can be used to etch features smaller than one wavelength (28nm).
How is that possible?
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Magnets!
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What about damaging the silicon? 13nm=Ionizing! (Score:4, Interesting)
IIRC, there's been plenty of research into using 13nm UV to do lithography. Intensity was one issue. The issue not mentioned in the summary is that 13nm is ionizing. It actually damages the silicon (and probably also the masks). So using 193nm, we get high process variation in part due to lithographic aberations (another cause is the randomness of dopant insertion). At 13nm, we get high variation due to damaging the device.
What's up with the mirrors? (Score:2)
Thanks for any insight.
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The picture seems to show the EUV light bouncing off 9 or 10 mirrors. What's up with that? It seems like getting good alignment on all that would be nearly impossible. Or are those "active" mirrors used for progressively correcting the alignment? What's up with those things?
Thanks for any insight.
Can't use diffractive optics at those wavelengths -- have to use reflective optics to prep the beam. Also, the beam itself isn't used for alignment, but shines through a stencil-like 'mask' that causes the features to be patterned in the photoresist.
One more thing -- photolithography itself isn't directly etching anything. It's used to generate patterns in a photoresist layer that is THEN used as a protective layer for etching etc. Subtle details...
The annon responses suck (Score:2)
Kilowatt range? (Score:2)
Maybe I'm not understanding something here, but a piece of machinery operating in a kilowatt range doesn't sound too bad. I got a dual 500watt shop light that operates in the kilowatt range. I'd be more than happy to chip in a quarter or two to pay for a few kilowatt-hours of power if I get one of the first processors. Hell, I'd even do a whole $20 and power the bad boy up for an entire week non-stop for the good
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Closer to reality? Really? (Score:2)
might be end of the line too (Score:2)
10 nm likely will be the end of CMOS silicon chips, gates can't be thinner than a single layer of atoms and quantum effects cause all manner of leaks, unpredictability and problems. So some new type of tech will be needed after circa 2015, whether carbon nanotech or perhaps quantum effects utilized
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transistors have been made that depend on quantum tunneling, and that work in predictable and digital manner. in one design gate voltage controls whether tunneling from one side to another is permitted or completely forbidden. In another a series of conductive "dots" on an insulator can hold charge or allow it to tunnel in or out based on a control voltage. so I'm looking forward to seeing which way industry goes in say three years, the business model of their survival depends on them making a solution
Alternative EUV Technology: Zplasma (Score:1)