Tiny Chiplets: a New Level of Micro Manufacturing

concealment sends this quote from the NY Times: "Today’s chips are made on large wafers that hold hundreds of fingernail-sized dies, each with the same electronic circuit. The wafers are cut into individual dies and packaged separately, only to be reassembled on printed circuit boards, which may each hold dozens or hundreds of chips. PARC researchers have a very different model in mind. ... they have designed a laser-printer-like machine that will precisely place tens or even hundreds of thousands of chiplets, each no larger than a grain of sand, on a surface in exactly the right location and in the right orientation. The chiplets can be both microprocessors and computer memory as well as the other circuits needed to create complete computers. They can also be analog devices known as microelectromechanical systems, or MEMS, that perform tasks like sensing heat, pressure or motion. The new manufacturing system the PARC researchers envision could be used to build custom computers one at a time, or as part of a 3-D printing system that makes smart objects with computing woven right into them."

diffrent chiplets manufactured separately,methinks

[girlinatrainingbra]

re: unless they can also come up with an inkjet like process to change process chemistry on minute parts of the wafer, they will run into the same cost issues as all other process-in-memory researchers.
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I believe that the different substrates used in the printer are manufactured separately. E.G. printer well #1 contains thousands or millions of copies of chiplet-type #1, well #2 contains only 10^3s to 10^6s copies of chiplet-type #2, etc. So these "ink supplies" can all be manufactured separately, so a memory chiplet could be made on a wafer with process physics fine-tuned for RAM production, whereas a logic or multiplexing or signal-crossover chiplet could be made on a wafer using process physics tuned for logic LSI / VLSI production. Thus the individual ink types are manufactured in an optimal manner for the type of chiplet.
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It's when the chiplets are "sprayed" or distributed onto the final substrate that the lasers are used to reposition and realign and reorient the chiplets in order to combine them into a composite computational structure. Or that's my reading of TFA (un /. like of me to RTFA, but I did!)...