Samsung '3D' Memory Coming, 50% Denser 87
CWmike writes "Samsung on Tuesday announced a new 8GB dual inline memory module (DIMM) that stacks memory chips on top of each other, which increases the density of the memory by 50% compared with conventional DIMM technology. Samsung's new registered or buffered (RDIMM) product is based on its current Green DDR3 DRAM and 40 nanometer (nm)-sized circuitry. The new memory module is aimed at the server and enterprise storage markets. The three-dimensional (3D) chip stacking process is referred to in the memory industry as Through Silicon Via (TSV). Samsung said the TSV process saves up to 40% of the power consumed by a conventional RDIMM. Using the TSV technology will greatly improve chip density in next-generation server systems, Samsung said, making it attractive for high-density, high-performance systems."
TIME TO BRING BACK CORE !! (Score:4, Funny)
Core memory is static in the true sense of the word. I've got core memory that hasn't changed a bit in 60 years. Punks !! You don't know memory.
Oh great. Dense memory. (Score:3, Funny)
It'll fit right in with my ex's computer. Stupid P.O.S. Gateway.
*takes a deep breath...* NOW WHEN SHE TYPES IN ALL CAPS and overuses LOL ON FOXNEWS.COM and adds a thousand!!!!!!!!!!!!!!! EXCLAMATION POINTS... her memory can be just as dense as she is.
Re:TIME TO BRING BACK CORE !! (Score:5, Funny)
Re:Oh great. Dense memory. (Score:4, Funny)
Re:Saves up to 40% power savings? (Score:4, Funny)
Trust me, DRAM power consumption is becoming a serious probpem.
So is apparently cosmic rays. ;)
Re:Saves up to 40% power savings? (Score:4, Funny)