IBM Water-Cools 3D Multi-Core Chip Stacks 170
An anonymous reader writes "Water cooling will enable multi-core processors to be stacked into 3D cubes, according to IBM's Zurich Research Laboratory which is demonstrating three-dimensional chip stacks. By stacking memory chips between processor cores IBM plans to multiply interconnections by 100 times while reducing their feature size tenfold. To cool the stack at a rate of 180 watts per layer, water flows down 50-micron channels between the stacked chips. Earlier this year, the same group described a copper-plate water cooling method for IBM's Hydro-Cluster supercomputer. The Zurich team predicts high-end IBM multicore computers will migrate from the copper-plate water-cooling-method to the 3-D chip-stack in five to 10 years." Reader Lilith's Heart-shape adds a link to the BBC's article on these internally-cooled chips.
3D cubes are nice, I guess (Score:5, Funny)
But the question is.... (Score:5, Funny)
my favorite (Score:2, Funny)
This will never work (Score:4, Funny)
Re:When will water cooling be feasible for ME? (Score:1, Funny)
"It was hot on my lap...so I water cooled it and now it won't turn on"
Re:Electrolysis (Score:3, Funny)
Risky (Score:2, Funny)
Imagine the mistakes of the future (Score:3, Funny)
Somewhere... (Score:3, Funny)
Somewhere there's a geek who has already accomplished this goal. He's using it to run Crysis at 4800x3600 with full detail, at 1600 frames per second, and no matter who he shows it off to, he still can't get laid.
Re:But the question is.... (Score:2, Funny)
He's still working on that one rock problem, though...
Re:When will water cooling be feasible for ME? (Score:1, Funny)
I found a picture of the chip! (Score:2, Funny)