Micron Displays Next-Gen LPCAMM2 Modules For Laptops At CES 2024 28
At CES 2024 this week, Micron demonstrated its next-gen LPCAMM2 memory modules based on LPDDR5X memory. Not only are they smaller and more powerful than traditional SODIMMs, they can be "serviced during the manufacturing process and upgraded by the user," says Micron. Tom's Hardware reports: Micron's LPCAMM2 are industry-standard memory modules that will be available in 16 GB, 32 GB, and 64 GB capacities as well as with speed bins of up to a 9600 MT/s data transfer rate. These modules are designed to replace conventional SODIMMs as well as soldered-down LPDDR5X memory subsystem while offering the best of both worlds: flexibility, repairability, and upgradeability of modular memory solutions as well as high performance and low power consumption of mobile DRAM. Indeed, a Micron LPCAMM2 module is smaller than a traditional SODIMM despite the fact that it has a 128-bit memory interface and up to 64 GB of LPDDR5X memory onboard. Needless to say, the module is massively smaller than two SODIMM memory sticks that offer a 128-bit memory interface both in terms of height and in terms of physical footprint.
Apple will find a way⦠(Score:1)
Nice try, engineers! But I am sure Apple will find a way to subvert the intentions of the designers and turn it into a non-serviceable, non-upgradable, and far overpriced part.
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I think Apple will just keep using its own parts, so they won't need to do anything with these devices at all.
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Apple's systems all have the RAM integrated into the CPU, so they couldn't care less what standards everyone else uses for removable RAM.
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Every computer Apple currently sells has an M series CPU. All the Intel based models are discontinued.
Alternate source (Score:4, Informative)
Engadget did a better writeup of the annoucement showing the progression of the Compression Attached Memory Module (CAMM) to the Low Powered CAMM (LPCAMM). Actually Samsung came out with their LPCAMM announcement late last year and Micron just announced their version at CES.
What is CAMM? [pcmag.com]
Samsung LPCAMM [tomshardware.com]
Better Micron announcement [engadget.com]
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Apple Mx processors use on package memory (Score:2)
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i do wish they offered an additional memory slot for slower system ram
Agreed. Even if slower slot RAM is used only for a swap file, it can still fill a role in the memory hierarchy.
Re: Apple Mx processors use on package memory (Score:1)
Itâ(TM)s called SSD, which is over a sufficiently fast interconnect, it effectively is as fast as DDR4 RAM. The problem with DDR5 is that itâ(TM)s so fast, not a single manufacturer has been able to put it in SO-DIMM format, because the distance from the left to the right of the module is too far for the speed of light. So you either put it on board or have to invent a non-standard like this CAMM format which is still inferior to the DDR6 HBM on GPU and modern ARM processors.
RAM doesn't suffer from flash wear (Score:2)
It's called SSD, which is over a sufficiently fast interconnect, it effectively is as fast as DDR4 RAM.
The difference is that a DDR4 RAM disk doesn't wear out as fast as multi-level-cell NAND flash memory when you put a swap file on it.
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Wearing out in high quality SSD hasn't been a problem for over a decade, even if you used it as RAM.
Maybe SLC doesn't have wear issues (Score:2)
This surprised me. I asked elsewhere and was told that anything more dense than SLC (1 bit per cell) has noticeablly lower write durability if used as swap for several years. And because SSD makers have long since replaced SLC with MLC or even more dense, I doubt any PC maker bundles a "high quality SSD" anymore. I'm open to evidence to the contrary, evidence that an MLC SSD swaps as fast a DDR4 RAM disk and has negligible wear even if used for a swap workload over its service life.
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Apple and other enterprise/datacenter vendors use high speed intake buffers on-die (or swap space in the case of Apple) by treating the area as SLC, then copy permanent data at a later time to the MLC. With wear leveling and other controller 'tricks', modern datacenter/enterprise SSDs can be fully written 3x per day and stay within spec (you can write 6TB to a 2TB SSD in a 24 hour period).
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The ARM based Mx processors use on package memory (HBM).
I thought that too, but it's not HBM, it's a bunch of package on package LPDDR in parallel.
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CES is doing its level best to promote itself as still being relevant.
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Maybe if you don't want to hear announcements about changing and developing tech, consider going to a news aggregator that actually matches whatever clearly non-tech hobby you prefer. Just because it has the word Micron in it, doesn't make it an advert.
It's nice to see Slashdot get back into running stories about hardware developments. You do deserve the offtopic mod you got. Also this isn't Reddit. We don't "vote" here, we moderate.
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The "mod" doesn't say Offtopic.
Just why? (Score:2)
Has anyone opened up a notebook recently? 50% empty space.
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Erm I have. And mine is 0% empty space, given that all "empty" space is taken up by a battery. I'm not sure what on earth you are buying if you have 50% empty space. That sounds like a pointlessly large device.
But in any case there's more to this than just space. The Dell CAMM patent shows quite clearly why this is the future direction for memory (for those people who don't want chips soldered directly on the board or on the CPU die). SODIMMs are getting to the point where signalling and timing issues are a
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Firstly yes I have and no it isn't. Secondly SODIMM has reached the end of the line electrically. It cannot be made to work with LPDDR memory. Personally I want low power notebooks to be upgradeable too since RAM is often the first thing to age out.
DELL jumped the gun a bit (Score:2)
By pioneering the CAMM design and rushing it to market, their standard was made obsolete literally within 1.5 years with JEDEC releasing CAMM2 in December. On the up side it's good a few DELL customers ironed out the bugs in the design.
Hopefully this puts an end to soldered on memory nonsense.
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"Hopefully this puts an end to soldered on memory nonsense."
Fuck no. Intel just showed off new processors with the RAM on-package. we're getting closer to removal of the RAM slot, entirely.
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There's a difference between RAM on die and RAM on motherboard. There will always be a requirement for component level compartmentalisation, it really doesn't matter what "Intel showed off". They don't need to show off anything. RAM on die or RAM on SoC is well over a decade old. The question is whether it is accepted outside of the Apple / integrated device crowd.