schwit1 writes: In 2010 Spectrum reported a new approach for creating chip-scale supercapacitors on silicon wafers, proposed by researchers at Drexel University in Philadelphia and the Universite Paul Sabatier in Toulouse, France. In an article published in Science, the researchers described how to make supercapacitor electrodes from porous carbon that could stick to the surface of silicon wafers so that they could be micromachined into electrodes for on-chip supercapacitors. Now the same team has finally succeeded in doing just that. In a paper published in this week's Science, researchers from the two initial teams report creating efficient porous carbon electrodes that really stick to the surface of a silicon wafer. They made layers of porous carbide derived carbon (CDC) that are completely compatible with all treatments used in the semiconductor industry, says Patrice Simon, a researcher at Universite Paul Sabatier who has researched porous CDC electrodes over the last ten years and co-authored both the 2010 and this week's paper in Science.