concealment sends this quote from the NY Times: "Today’s chips are made on large wafers that hold hundreds of fingernail-sized dies, each with the same electronic circuit. The wafers are cut into individual dies and packaged separately, only to be reassembled on printed circuit boards, which may each hold dozens or hundreds of chips. PARC researchers have a very different model in mind. ... they have designed a laser-printer-like machine that will precisely place tens or even hundreds of thousands of chiplets, each no larger than a grain of sand, on a surface in exactly the right location and in the right orientation. The chiplets can be both microprocessors and computer memory as well as the other circuits needed to create complete computers. They can also be analog devices known as microelectromechanical systems, or MEMS, that perform tasks like sensing heat, pressure or motion. The new manufacturing system the PARC researchers envision could be used to build custom computers one at a time, or as part of a 3-D printing system that makes smart objects with computing woven right into them."
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