TSMC To Spend $10B Building Factory for 450mm Wafers 104
An anonymous reader writes "With demand for processors growing and costs rising, using larger wafers for manufacturing is highly desirable, but a very expensive transition to make. TSMC just announced it has received approval from the Taiwan government to build a new factory for 450mm wafers, with the total cost of the project expected to be between $8-10 billion. The move to larger wafers isn't without its risks, though. Building new facilities to handle production is the easy part. The industry as a whole has to overcome some major technical hurdles before 450mm becomes a viable replacement for the tried and tested 300mm process. TSMC's chairman Morris Chang has stated the next five years will be filled with technical challenges, suggesting 450mm wafers may not be viable until at least 2017."
Die's per Wafer estimation (Score:2, Insightful)
300mm = 58615762400 DPW
450mm = 10228963043666936 DPW
If the newest 22nm process is used. By the time the factory gets up and running there may be even better efficiencies that could be adapted. It is an expensive venture but at some point either the economics work out or you need to build a new factory anyways. It is good to see progress.