IBM, 3M Team To Glue Together Silicon "Bricks"

coondoggie writes "IBM and 3M today said they will jointly develop a new line of adhesives they hope will let them make it possible to build commercial microprocessors composed of layers of up to 100 separate chips. Such stacking would allow for higher-powered servers and more advanced consumer electronics applications, the companies stated. Processors could be tightly packed with memory and networking, for example, into a 'brick' of silicon that would create a computer chip 1,000 times faster than today's fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices."

So...

[Ibiwan]

Stacking these things is all well and good, but at what point do heat considerations become a primary concern? Lately I haven't gotten the impression that volume of ICs is our biggest bottleneck.