Stories
Slash Boxes
Comments
typodupeerror delete not in
  • Preferences

+-   IBM water cools 3D multi-core chip stacks-> on Thursday June 05 2008, @01:21PM Anonymous Coward

Submitted by Anonymous Coward on Thursday June 05 2008, @01:21PM
supercomputing
An anonymous reader writes "Water cooling will enable multi-core processors to be stacked into 3D cubes, according to IBM's Zurich Research Laboratory which is demonstrating three-dimensional chip stacks. By stacking memory chips between processor cores IBM plans to multiply interconnections by 100 times while reducing their feature size tenfold. To cool the stack at a rate of 180 watts per layer, water flows down 50-micron channels between the stacked chips. Earlier this year, the same group described a copper-plate water cooling method for IBM's Hydro-Cluster supercomputer. The Zurich team predicts high-end IBM multicore computers will migrate from the copper-plate water-cooling-method to the 3-D chip-stack in five to 10 years."
Link to Original Source
submission
This discussion was created for logged-in users only, but now has been archived. No new comments can be posted.
The Fine Print: The following comments are owned by whoever posted them. We are not responsible for them in any way.

IBM water cools 3D multi-core chip stacks 0 Comments More /

 Full
 Abbreviated
 Hidden
More
Loading... please wait.
Search
The real reason psychology is hard is that psychologists are trying to do the impossible.

All trademarks and copyrights on this page are owned by their respective owners. Comments are owned by the Poster. The Rest © 1997-2009 Geeknet, Inc.