Lucas123 writes "With 3D NAND flash going into high production and one startup demonstrating a resistive NAND (RRAM) flash array, it may not be long before mobile devices have hundreds of gigabytes of capacity, even a terabyte, with performance only limited by the bus. Samsung announced it is now mass producing three-dimensional (3D) Vertical NAND (V-NAND) chips, and start-up Crossbar said it has created a prototype of its RRAM chip. Both technologies offer many times what current NAND flash chips offer today in capacity and performance. Which technology will prevail is still up in the air, and experts believe it will be years before RRAM can challenge NAND, but it's almost inevitable that RRAM will overtake NAND as even 3D NAND heads for an inevitable dead end. Others believe 3D NAND, currently at 24 layers, could reach more than 100, giving it a lifespan of five or more years."