IBM Doubles CPU Cooling With Simple Change

Ars Technica is reporting that IBM has discovered a new cooling breakthrough that, unlike several other recent announcements, should be relatively easy and cost-effective to implement. "IBM's find addresses how thermal paste is typically spread between the face of a chip and the heat spreader that sits directly over the core. Overclockers already know how crucial it is to apply thermal paste the right way: too much, and it causes heat buildup. Too little, and it causes heat buildup. It has to be "just right," which is why IBM looked to find the best way to get the gooey stuff where it needs to be and in the right amount, and to make it significantly more efficient in the process."

Gooey stuff

[Experiment 626]

IBM looked to find the best way to get the gooey stuff where it needs to be and in the right amount

I know some sites with plenty of AVIs that will show you how to do that...

Re:user a razor

[Anonymous Coward]

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Re:Did you read the article?

[Anonymous Coward]

A 1/3 reduction gives 50% so a 3/3 reduction should give 150%!!!!!one