Building Chips Like LEGO 50
MattSparkes writes "It seems that 3D silicon chips, allowing designers to fit more components into a smaller space, could soon be made far easier to create with a little inspiration from a classic children's toy. "Silicon wafers covered with matching patterns of Lego-like teeth and holes could aid the development of 3D electronics, say UK researchers." Crucially, this technique can make use of existing machinery."
Patents? (Score:1, Interesting)
Coooling (Score:5, Interesting)
If the stack is open, then could the cooling actually be better than a single over the top method.
This could work like the fins inside double layered home radiators.
Re:Coooling (Score:3, Interesting)
One could use special cooling-building blocks. These would even be placed right next to the most-heat producing parts of the overall system and enhance the overall cooling effect.
Low power components (Score:3, Interesting)
Also, this could reduce the cost even more in the low cost market - instead of needing a PCB with soldered connections, just put all the components on top each other.
This reminded me of something... (Score:3, Interesting)
Re:Low power components (Score:3, Interesting)
a benifit beond the obvius (Score:2, Interesting)
Re:Patents? (Score:5, Interesting)
If you have silicon chips that fit together like little plastic children's toy blocks, that's perfectly fine. But if you mention the word Lego - even in internal company documents - you'll have a swarm of lawyers knocking at your door. (Yes, this has happened before).
Heathkit (Score:4, Interesting)
(If anyone out there has the kit and wants to sell it, drop me a line.)